Method for Evaluating the Degree of Metallization Corrosion Damage of Integrated Circuits used in construction as part of products of industrial electronics and computer technology
V.I. Kolomiets, cand.tech.sci.
Moscow State University of Civil Engineering
(National Research University)
Abstract. The evaluation results of the accelerated tests for the corrosion resistance of metallization of integrated circuits have been considered. It has been proposed to use the average area of corrosion damage to bond pads and the average number of damage to metallization as an indicator of the degree of metallization damage. The evaluation method is applicable for comparative tests of various structural and technological options for the manufacture of integrated circuits.
Key words: integrated microcircuit, corrosion of aluminum metallization, electrolytic corrosion, humidity, temperature, median time to failure, accelerated tests, metallization, bond pad.